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µðÆ÷±×´Â °í¹Ðµµ AI/HPC ·¢, DLC ±â¹Ý ¼ö³Ã ¼Ö·ç¼Ç, Àü·Â ÀÎÇÁ¶ó, ³×Æ®¿öÅ©, ¿î¿µ ¹× °ü¸®±îÁö AI¿Í HPC ½Ã´ë°¡ ¿ä±¸ÇÏ´Â µ¥ÀÌÅͼ¾ÅÍ ÀÎÇÁ¶ó Àü¹ÝÀ» End-to-End·Î ¼³°èÇÏ°í ±¸ÃàÇÏ´Â ÅëÇÕ ÀÎÇÁ¶ó ±â¾÷ÀÔ´Ï´Ù.

- Racking System : Rack, Structural Ceiling Grid, Cable Tray, Containment
- OCP : ORV3 Rack & Power
- Power Solution : Busway, °íÀü·Â PDU
- Cooling Soltuion : Coil Wall, In-Row, Rear Door(RDHx), DLC(Direct Liquid Chip Cooling), Immersion
- Management Solution : DCIM

°í°´°ú ÇÔ²² AI¿Í HPC ½Ã´ë¸¦ ¼±µµÇϸç, µ¥ÀÌÅͼ¾ÅÍ ÀÎÇÁ¶óÀÇ ¹Ì·¡¸¦ ¼³°èÇÕ´Ï´Ù.
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- Racking System : Structural Ceiling Grid, Rack & Cable Tray
- OCP : ORV3 Rack & Power
- Power Solution : Busway, °íÀü·Â PDU
- Cooling Soltuion : DLC(Direct Liquid Chip Cooling), Rear Door Cooler (RDHx)
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